Flux Easy Print Sn96.5/Ag3/Cu0.5, 1.4ml, za SMD lemljenje, bez naknadnog čišćenja

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Šifra proizvoda: #18989

FLUX EASPR CU 1.4ML

Flux Easy Print Sn96.5/Ag3/Cu0.5, 1.4ml, za SMD lemljenje, bez naknadnog čišćenja

Paste for soldering of surface-mounted (SMD) components

A ‘No Clean’ type paste is designed for soldering SMD components in production processes that do not include washing phase.

Resistant to solderballing ( mid chip solderballing )

Good adhesion to components for over 24hrs after application

Exhibits long stencil life even for 8hrs of continuous printing, prolonged usability (stencil life)

Low level of colourless, non-corrosive soldering residues ( no clean ), that are flexible enough to allow penetration of tester needles

Fine pitch

Printing with squeegee speed up to 150mm/s

Apart from metals powders, the product composition includes resin based and solvent based flux, activators that remove oxides and thixotropic additions, responsible for viscosity and plasticity.

The paste does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.

Additional properties of the paste:
– it does not contain chlorides,
– flux residue neither corrodes, nor requires washing,
– soldered joints have good mechanical and electrical properties.

720,91 din (1-9 kom)
648,82 din (10-99 kom)
586,28 din (>100 kom)