Easy Print/Solder Paste Sn96.5/Ag3/Cu0.5 1.4

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Šifra proizvoda: #18989

FLUX EASPR CU 1.4ML

Easy Print/Solder Paste Sn96.5/Ag3/Cu0.5 1.4

Paste designed for soldering SMD components in production processes that do not include washing phase. It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface. It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.

Additional properties of the paste:
– it contains rosin-based flux ,
– presence of activator that prevents the forming of air bubbles in the soldered joints,
– joints have very good mechanical and electrical properties.
If the process includes the washing phase, this can be done with commonly available agents (Water based PCB cleaner, Alcohol based PCB cleaner).

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